Polyurethane reactive hot melt adhesive
Assembly structure bonding, suitable for various substrates: metal, glass, engineering plastic, etc.
Low temperature epoxy adhesive
Fingerprint sensor module, camera sensor module, PCB electronic components bonding, waterproofing, sealing, etc.
PCB underfill, chip underfill; fast flow and easy rework
UV curing adhesive
Electronic parts bonding and reinforcement, waterproof sealing, metal highlight protection, peelable